Uni-Flex Circuits

Driven by Technology, Focused on Quality

Capabilities

Uni-Flex Circuits, Inc. understands that customers are often looking for a one-stop shop to handle their flex circuit design, fabrication, as well as assembly needs. Working with a single company reduces product handling and lead time associated with outsourcing each of these tasks.

Whether your idea is a sketch or diagram, we'll help you design a cost-effective interconnect solution. Uniflex is also set up to handle component assembly, including connectors and various surface mount components. The following are common capabilities. Call (408) 998-5500 to discuss tighter tolerances or special process requirements.

Common Capabilities

1. Polyimide Films 0.5 mil (.0005"), 1 mil (.001"), 2 mils (.002"), 3 mils (.003"), 5 mils (.005") 12 mils (.012")
2. Thermo-Bond Adhesives Acrylic/Modified Acrylic, and Modified Epoxy
3. Copper Foils (Rolled-Annealed) 1/4 oz., 1/3 oz., 1/2 oz. (.0007"), 1 oz. (.0014"), 2 oz. (.0028")
4. Stiffeners FR-4, Polyimide, Metal, or Customer Supplied
5. FR-4 in Multi-Layer Flex Circuits Laminated to Flex Circuit to Create Rigid Flex Boards, Typically with Vias
6. Surface Finish Solder (Hot Air Leveling or Electrolytic Plating), Electroless Au and Ni, Silver, Tin Plating
7. Other Materials or Finishes Speak with Us Concerning Your Special Requirement

Artwork Capabilities

Feature   special processes Standard
Minimum Copper Trace/Space 0.25 oz. (9 µm) 0.001"/0.0015" 0.0015"/0.002"
0.33 oz. (12 µm) 0.0015"/0.0015" 0.002''/0.002"
0.5 oz. (18 µm) 0.002''/0.002" 0.0025"/0.0025"
1 oz. (35 µm) 0.003"/0.003" 0.0035"/0.0035'
Minimum Via Hole Diameter NC Drill 0.003" 0.006"
UV Laser 0.002" 0.004"
Minimum Blind Via Diameter UV Laser 0.004" 0.006"
Layer to Layer Artwork Registration Double Sided 0.001" 0.004"
Trace to Edge Tolerance NC Route NA 0.005"
UV Laser 0.001" 0.001"
Insulator Positional Tolerance Cover Film 0.001" 0.003"
LPI 0.001" 0.002"
Minimum Cover Layer Opening 0.5 mil (12 µm) 0.0005" 0.001"
1 mil (25 µm) 0.001" 0.002"
Cover Layer Adhesive Bleed 0.5 mil (12 µm) 0.0005" 0.001"
1 mil (25 µm) 0.001" 0.002"
Minimum Cover Layer Webbing Width 0.5 mil (12 µm) 0.004" 0.004"
1 mil (25 µm) 0.006" 0.006"
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