Driven by Technology, Focused on Quality
Uni-Flex Circuits, Inc. understands that customers are often looking for a one-stop shop to handle their flex circuit design, fabrication, as well as assembly needs. Working with a single company reduces product handling and lead time associated with outsourcing each of these tasks.
Whether your idea is a sketch or diagram, we’ll help you design a cost-effective interconnect solution. Uniflex is also set up to handle component assembly, including connectors and various surface mount components. The following are common capabilities. Call (408) 998-5500 to discuss tighter tolerances or special process requirements.
| 1. Polyimide Films | 0.5 mil (.0005"), 1 mil (.001"), 2 mils (.002"), 3 mils (.003"), 5 mils (.005") 12 mils (.012") |
| 2. Thermo-Bond Adhesives | Acrylic/Modified Acrylic, and Modified Epoxy |
| 3. Copper Foils (Rolled-Annealed) | 1/4 oz., 1/3 oz., 1/2 oz. (.0007"), 1 oz. (.0014"), 2 oz. (.0028") |
| 4. Stiffeners | FR-4, Polyimide, Metal, or Customer Supplied |
| 5. FR-4 in Multi-Layer Flex Circuits | Laminated to Flex Circuit to Create Rigid Flex Boards, Typically with Vias |
| 6. Surface Finish | Solder (Hot Air Leveling or Electrolytic Plating), Electroless Au and Ni, Silver, Tin Plating |
| 7. Other Materials or Finishes | Speak with Us Concerning Your Special Requirement |
| Feature | special processes | Standard | |
|---|---|---|---|
| Minimum Copper Trace/Space | 0.25 oz. (9 µm) | 0.001"/0.0015" | 0.0015"/0.002" |
| 0.33 oz. (12 µm) | 0.0015"/0.0015" | 0.002''/0.002" | |
| 0.5 oz. (18 µm) | 0.002''/0.002" | 0.0025"/0.0025" | |
| 1 oz. (35 µm) | 0.003"/0.003" | 0.0035"/0.0035' | |
| Minimum Via Hole Diameter | NC Drill | 0.003" | 0.006" |
| UV Laser | 0.002" | 0.004" | |
| Minimum Blind Via Diameter | UV Laser | 0.004" | 0.006" |
| Layer to Layer Artwork Registration | Double Sided | 0.001" | 0.004" |
| Trace to Edge Tolerance | NC Route | NA | 0.005" |
| UV Laser | 0.001" | 0.001" | |
| Insulator Positional Tolerance | Cover Film | 0.001" | 0.003" |
| LPI | 0.001" | 0.002" | |
| Minimum Cover Layer Opening | 0.5 mil (12 µm) | 0.0005" | 0.001" |
| 1 mil (25 µm) | 0.001" | 0.002" | |
| Cover Layer Adhesive Bleed | 0.5 mil (12 µm) | 0.0005" | 0.001" |
| 1 mil (25 µm) | 0.001" | 0.002" | |
| Minimum Cover Layer Webbing Width | 0.5 mil (12 µm) | 0.004" | 0.004" |
| 1 mil (25 µm) | 0.006" | 0.006" |
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