Our capabilities in PCB manufacturing encompass advanced technologies and processes, ensuring high-quality and precision in every circuit board we produce.
Capabilities
Uni-Flex Circuits, Inc. understands that customers are often looking for a one-stop shop to handle their flex circuit design, fabrication, as well as assembly needs. Working with a single company reduces product handling and lead time associated with outsourcing each of these tasks.
Whether your idea is a sketch or diagram, we’ll help you design a cost-effective interconnect solution. Uni-Flex is also set up to handle component assembly, including connectors and various surface mount components. The following are common capabilities. Call +1(408) 998-5500 to discuss tighter tolerances or special process requirements.
Our Capabilities
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Polyimide Films
0.5 MIL (0.0005") (0.0127 mm)
1.0 MIL (0.001") (0.0254 mm)
2.0 MIL (0.002") (0.0508 mm)
3.0 MIL (0.003") (0.0762 mm)
5.0 MIL (0.005") (0.127 mm)
12.0 MIL (0.012") (0.3048 mm)
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Thermo-Bond Adhesives
Acrylic/Modified Acrylic
Modified Epoxy
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Copper Foils
1/4 OZ (0.00035”) (8.89μm)
1/3 OZ (0.0004667”) (11.85 μm)
1/2 OZ (0.0007") (17.78 μm)
1.0 OZ (0.0014") (35.56 μm)
2.0 OZ (0.0028") (71.12 μm)
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Stiffeners
FR-4
Polyimide
Metal
Porcelain
Stainless Steel
Or Customer Supplied
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FR-4 in Multilayer Circuits
Laminated to Flex Circuit to Create Rigid Flex Boards, Typically with Vias.
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Surface Finish
Solder (Hot Air Leveling or Electrolytic Plating)
Electroless Gold and Nickel, Silver, Tin Plating
Hard Gold
Soft Bondable Gold
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Other Materials or Finishes
Speak with us concerning your special requirement
Artwork Capabilities
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1/4 oz (9 µm)
Special Processes: 0.001”/0.0015”
Standard: 0.0015”/0.002”
1/3 oz (12 µm)
Special Processes: 0.0015”/0.0015”
Standard: 0.002”/0.002”
1/2 oz (18 µm)
Special Processes: 0.002”/0.002”
Standard: 0.0025”/0.0025”
1.0 oz (35 µm)
Special Processes: 0.003”/0.003”
Standard: 0.0035”/0.0035”
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NC Drill
Special Processes: 0.003”
Standard: 0.006”
UV Laser
Special Processes: 0.002”
Standard: 0.004”
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UV Laser
Special Processes: 0.004”
Standard: 0.006”
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Double Sided
Special Processes: 0.001”
Standard: 0.004”
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NC Route
Standard: 0.005”
UV Laser
Special Processes: 0.001”
Standard: 0.001”
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Cover Film
Special Processes: 0.001”
Standard: 0.003”
Liquid Photo Image (LPI)
Special Processes: 0.001”
Standard: 0.002”
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0.5 mil (12 µm)
Special Processes: 0.0005”
Standard: 0.001”
1.0 mil (25 µm)
Special Processes: 0.001”
Standard: 0.002”
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0.5 mil (12 µm)
Special Processes: 0.0005”
Standard: 0.001”
1.0 mil (25 µm)
Special Processes: 0.001”
Standard: 0.002”
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0.5 mil (12 µm)
Special Processes: 0.004”
Standard: 0.004”
1.0 mil (25 µm)
Special Processes: 0.006”
Standard: 0.006”