Our capabilities in PCB manufacturing encompass advanced technologies and processes, ensuring high-quality and precision in every circuit board we produce.

Capabilities

Uni-Flex Circuits, Inc. understands that customers are often looking for a one-stop shop to handle their flex circuit design, fabrication, as well as assembly needs. Working with a single company reduces product handling and lead time associated with outsourcing each of these tasks.

Whether your idea is a sketch or diagram, we’ll help you design a cost-effective interconnect solution. Uni-Flex is also set up to handle component assembly, including connectors and various surface mount components. The following are common capabilities. Call +1(408) 998-5500 to discuss tighter tolerances or special process requirements.

Our Capabilities

  • Polyimide Films

    0.5 MIL (0.0005") (0.0127 mm)

    1.0 MIL (0.001") (0.0254 mm)

    2.0 MIL (0.002") (0.0508 mm)

    3.0 MIL (0.003") (0.0762 mm)

    5.0 MIL (0.005") (0.127 mm)

    12.0 MIL (0.012") (0.3048 mm)

  • Thermo-Bond Adhesives

    Acrylic/Modified Acrylic

    Modified Epoxy

  • Copper Foils

    1/4 OZ (0.00035”) (8.89μm)

    1/3 OZ (0.0004667”) (11.85 μm)

    1/2 OZ (0.0007") (17.78 μm)

    1.0 OZ (0.0014") (35.56 μm)

    2.0 OZ (0.0028") (71.12 μm)

  • Stiffeners

    FR-4

    Polyimide

    Metal

    Porcelain

    Stainless Steel

    Or Customer Supplied

  • FR-4 in Multilayer Circuits

    Laminated to Flex Circuit to Create Rigid Flex Boards, Typically with Vias.

  • Surface Finish

    Solder (Hot Air Leveling or Electrolytic Plating)

    Electroless Gold and Nickel, Silver, Tin Plating

    Hard Gold

    Soft Bondable Gold

  • Other Materials or Finishes

    Speak with us concerning your special requirement

Artwork Capabilities

  • 1/4 oz (9 µm)

    Special Processes: 0.001”/0.0015”

    Standard: 0.0015”/0.002”

    1/3 oz (12 µm)

    Special Processes: 0.0015”/0.0015”

    Standard: 0.002”/0.002”

    1/2 oz (18 µm)

    Special Processes: 0.002”/0.002”

    Standard: 0.0025”/0.0025”

    1.0 oz (35 µm)

    Special Processes: 0.003”/0.003”

    Standard: 0.0035”/0.0035”

  • NC Drill

    Special Processes: 0.003”

    Standard: 0.006”

    UV Laser

    Special Processes: 0.002”

    Standard: 0.004”

  • UV Laser

    Special Processes: 0.004”

    Standard: 0.006”

  • Double Sided

    Special Processes: 0.001”

    Standard: 0.004”

  • NC Route

    Standard: 0.005”

    UV Laser

    Special Processes: 0.001”

    Standard: 0.001”

  • Cover Film

    Special Processes: 0.001”

    Standard: 0.003”

    Liquid Photo Image (LPI)

    Special Processes: 0.001”

    Standard: 0.002”

  • 0.5 mil (12 µm)

    Special Processes: 0.0005”

    Standard: 0.001”

    1.0 mil (25 µm)

    Special Processes: 0.001”

    Standard: 0.002”

  • 0.5 mil (12 µm)

    Special Processes: 0.0005”

    Standard: 0.001”

    1.0 mil (25 µm)

    Special Processes: 0.001”

    Standard: 0.002”

  • 0.5 mil (12 µm)

    Special Processes: 0.004”

    Standard: 0.004”

    1.0 mil (25 µm)

    Special Processes: 0.006”

    Standard: 0.006”