Flex circuits have found their way into a myriad of applications spanning many markets including computer, data communications, consumer, medical, military, and aerospace. Common applications include: laptop computers, ink jet printers, hard disk drives, optical storage drives, cellular phones, video tape recorders, auto-focus cameras, portable CD players, finger oximeters, GPS, flat panel displays, and so on. With the inherent advantage of being light weight, flexible, bendable, and reliable, interconnect solutions become governed by volume as opposed to space of a two-dimensional hard board. Flex circuits are fully surface ntable to accommodate surface mount, chip-on-flex, as well as flip-chip technology.
The following are common types of flex circuit constructions. Come speak to us about your fabrication requirements.
A single-layer construction with a polyimide cover film laminated to copper allowing access from one side only.
Consists of double-sided copper clad material with top and bottom cover films. The cover films are pre-routed to access copper from both sides using plated thru holes.
Same construction as single-sided flex; however, pre-routed openings are made in the cover film allowing access to both sides of the copper layer.
Consists of multiple layers of single and/or double-sided material laminated with thermoset adhesive. Layers range from 3 to 10 layers.
Consists of a single-sided flex circuit with copper foil and relieved in certain areas to achieve maximum flexibility – especially in the dynamic region. This will have double-sided construction in certain areas and single-sided construction in the dynamic area.
A combination of single and/or double-sided flex laminated with thermoset adhesive onto a single and/or double-sided FR-4 clad material. Layers range from 1 to 8 layers in the flex area and up to 10 layers in the rigid area.
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